PCB Assembly Capability










Highfive PCBA provides

  • Rigid, Flexible-Rigid, Flexible PCB Assembly EMS with cost-effective printed circuit board assembly design and assembly services. We specialize in accommodating different requirements for volume, mix, and complexity.
  • One piece sample or mass production assembly, we have Sample production line and mass production lines to match different quantity
  • We meet our customer’s time to market schedules while minimizing total landed costs.
  • Our services are in a range of volume requirements from low-volume complex, custom products to high-volume standard products. Our lead times can be as short as one week for standard products.
  • Highfive PCBA performs PCBA project management, design, documentation and artwork generation by using the latest software technologies to produce the highest quality products.
  • Our Program Managers and Engineers are experts in CAD Star, Allegro, PADS, Mentor and CCT for PCBA layout.
  • Our engineers can perform board layout from the customer’s schematic and will perform a Design For Manufacturing (DFM), Design For Test (DFT), and cost reduction review. We can also modify any existing drawing to customer specification.
  • We have experience in many methods of printed circuit board assembly, from thru-hole and mixed technology to customized fine pitch surface mount technologies. Highfive PCBA’s complete breadth of manufacturing services and in-house testing capabilities keep product costs down, ensure product security and meet time to market requirements.

Electronic Manufacturing Services

  • PCBA layout

  • Design evaluation

  • Prototype builds

  • Pre-production assistance

  • Design For Manufacturing (DFM)

  • Design For Test (DFT)

  • Design For Cost

PCBA Technologies

  • BGA, Micro BGA
  • Flip Chip, Chip On Board (COB)
  • Tape Automated Bonding (TAB)
  • Bare die wire bonding
  • PCMCIA
  • Flying probe
  • Selective Soldering

Surface Mount Capabilities

  • PCBA for a wide range of volume, mix and complexity requirements
  • No clean or aqueous solder process
  • Fine pitch screen printing/placement down to 8 mil (.008″)
  • Odd form part placement
  • Mixed technology
  • Mil-Spec
  • 01005 and 0201 Chip Components
  • MELFs

Thru-Hole Capabilities

  • No-Clean
  • Water wash
  • Ionic contamination testing
  • Axial Insertion
  • DIP Insertion
  • Component Lead Forming

In-Circuit Test Capabilities

  • X-Ray
  • Automated Optical Inspection (AOI)
  • In-circuit Test (ICT)
  • Functional Certification Test (FCT)

Assembly & Test Equipment

  • Screen Printers
  • Solder Paste Inspection (AOI)
  • Leading-edge X-Ray 3-D solder paste inspection
  • Surface Mount Lines: Universal & FUJI High-speed placement, MYDATA low volume/high mix
  • Fine Pitch/Odd Form Placement: Universal AdVantis
  • Force Convection Reflow: Heller and BTU (Nitrogen)
  • Fine Pitch/BGA Re-work: Conceptronics Freedom 3000
  • Thru-Hole Lines: Universal and Dynaport Axial & Radial Inserters,DIP Inserters
  • Wave Solder Machines
  • Selective Soldering
  • X-Ray Inspection System
  • In-circuit Test: Agilent Series
  • Automated Optical Inspection
  • Product specific functional testing