Rigid Board Capabilities

 

Rigid board Capabilities for Material

  • Rogers, 4003, 4350, Rogers+FR-4 Hybrid
  • Nelco 4000 Series
  • Per IPC-4101
  • Multi-functional FR-4
  • FR-406, FR-408, IS410, 370HR
  • FR-4 Tg,
  • Hi-Tg,
  • Halogen-free,
  • BT Epoxy,
  • Teflons,
  • Arlon,
  • Taconics,
  • RCC,
  • Cyanate Ester,
  • Polyimide,
  • Nelcon,
  • Getek,
  • Allied 408,
  • CEM3,
  • ceramic,
  • PTFE, etc.

Rigid Board Capacities for Construction

  • Minimum core thickness: 0.003″
  • * Minimum prepreg: 0.002″
  • * Mixed dielectrics
  • * Controlled dielectrics
  • * Controlled impedance
  • * Impedance Layer Stack-up
  • * Blind via, buried via
  • * Silver Filled Via holes
  • * Min. PCB thickness 0.010″
  • * Max. PCB thickness 0.283″ (7.2mm)

Rigid Board Capabilities of Surface Finishing

  • HASL ( Hot Air Solder Leveling)
  • Immersion Silver
  • Immersion Gold
  • Soft Bondable Gold
  • Electronlytic Gold (Knoop Hardness 120 or <)
  • Soft Electrolytic Gold (Knoop Hardness 90 or <)
  • OSP (Organic Solderability Preservative)
Highfive 8L Rigid Board ENIG Fine BGA PCB
Highfive 8L RIGID BOARD ENIG Fine BGA PCB

Rigid Board Materials for Processing

  • Via Hole Filled (Plated shut)
  • Via Hole Filled (CB100 Silver)

Rigid Capabilities for PCB Processes

No. Item Value
1 Min Line Trace Width (Outer and Inner) 3 mil
2 Min Line Space (Outer and Inner) 3 mil
3 Max Layer Count 40
4 Min Hole Diameter 6 mil
5 Min. HWTC (mil) 7 mil
6 Hole Location Dimension 2 mil
7 Fabrication Radius +/5 Degrees
8 Warpage/Inch 3 mil
9 Solder-mask Space 3 mil
10 NPTH Hole Size Tolerance 1 mil
11 Peel-able Testing 1.4N/mm
12 Max. Aspect Ratio 12:1
13 SMT Pitch/BGA Pitch (mil) 18 mil /12 mil
14 Plating Thickness (1).Plating Ni Thickness:2.5~5um.(2).Plating Au Thickness:0.05~2um (per client)
15 Registration Layer-to-layer 2 mil
16 Impedance Control +/-7%(5%)
17 Blind & Buried Yes
18 HDI 3+N+3, N+N
19 Base Copper 1/3,…, 6 OZ, 4 OZ with UL
20 Copper Thickness (Outer) 5 OZ
21 Registration Layer to Layer 3 mil
22 Max Board Thickness 120 mil
23 Board Thickness Tolerance 5%
24 Lead-free HASL 2-5 um or Per customer requirements
25 ENIG 0.03-0.15um
26 Flash Gold 0.05-0.1 um
27 Thick Gold 0.1-2.0 um
28 Immersion Silver 0.1-0.5 um
29 Immersion Tin 0.8-1.2 um
30 OSP 0.1-0.5um,ENTEK
31 Selective Gold Plating Per customer requirements
32 Selective OSP/HASL Per customer requirements