IC Substrate PCB

IC substrates serve as the connection between IC chip(s) and the PCB through a conductive network of traces and holes. IC substrates support critical functions including circuit support and protection, heat dissipation, and signal and power distribution.

IC substrates represent the highest level of miniaturization in PCB manufacturing and shares many similarities with semiconductor manufacturing. We produces many types of IC substrates on which IC chip(s) are attached to the IC substrate utilizing wire bonding and, or flip chip methods. Advanced technology IC substrates that Highfive can provide include:

CSP (Chip Scale Packages)

FC-CSP (Flip Chip) CSP

BOC (Board on Chip)

PoP (Package on Package)

PiP (Package in Package)

SiP (System in Package)

RF Module

LED Package

Advanced Capabilities:

Minimum line width and spacing: 20/20 µm

Minimum laser via/pad: 45/95 µm

Bump pad: minimum 150 µm bump pitch

Bump material: SAC305

Structure: any layer, coreless, cavity, embedded passive, embedded circuit

Wide material and surface finish options available

Ultrathin board capability:
Thin board layers Thickness capability/(mm) Remark
Min. (2L) 0.11+/-0.02 Core Type
Min. (3L) 0.12+/-0.02 Coreless Type
Min. (4L) 0.15+/-0.02 Core Type
Min. (6L) 0.18+/-0.02 Core Type
Min. (8L) 0.22+/-0.03 Coreless Type